Patent Assignment
Reel/Frame 056580/0438
Assignment of Assignor's Interest
Recorded: 2021-06-17
Pages: 3
Assignor
ZINCK, CHRISTOPHE
Executed: 2021-06-16
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same