Semiconductor device package and method of manufacturing the same
The present disclosure provides a semiconductor device package including a substrate, a waveguide component, and an antenna pattern. The substrate includes a feeding element. The waveguide component is disposed over the substrate. The antenna pattern is disposed over the substrate. The waveguide component is substantially aligned with the feeding element and the antenna pattern.
1. A semiconductor device package, comprising:
a substrate comprising a feeding element;
a waveguide component disposed over the substrate; and
an antenna pattern disposed over the substrate, wherein the waveguide component is substantially aligned with the feeding element and the antenna pattern,
wherein a projection of the waveguide component on the substrate is around a periphery of a projection of the antenna pattern on the substrate, and
wherein the waveguide component comprises a plurality of conductive structures spaced apart from each other.
2. The semiconductor device package of claim 1 , wherein the antenna pattern is spaced apart from the waveguide component.
3. The semiconductor device package of claim 2 , wherein the antenna pattern is disposed outside of the waveguide component.
4. The semiconductor device package of claim 1 , further comprising a reflector disposed on a side of the substrate opposite to the waveguide component and configured to reflect electromagnetic waves.
5. The semiconductor device package of claim 4 , wherein the reflector comprises a through hole connecting a cavity of the reflector to an outside of the semiconductor device package.
6. The semiconductor device package of claim 5 , wherein the reflector further comprises a conductive layer on an inner surface of the cavity.
7. The semiconductor device package of claim 6 , further comprising an encapsulant encapsulating the reflector, wherein a lower surface of the reflector is exposed by the encapsulant.
8. The semiconductor device package of claim 1 , wherein a distance between the adjacent conductive structures is arranged less than a wavelength of an electromagnetic wave configured for coupling the antenna pattern or the feeding element.
9. The semiconductor device package of claim 1 , further comprising an encapsulant encapsulating the waveguide component.
10. The semiconductor device package of claim 9 , wherein the encapsulant has an upper surface spaced apart from the waveguide component by a gap.
11. A semiconductor device package, comprising:
a substrate comprising a feeding element;
a waveguide component disposed over the substrate;
an antenna pattern disposed over the substrate, wherein the waveguide component is substantially aligned with the feeding element and the antenna pattern; and
an encapsulant encapsulating the waveguide component,
wherein the antenna pattern is spaced apart from the waveguide component by the encapsulant.
12. A semiconductor device package, comprising:
a substrate comprising a first surface and a second surface opposite to the first surface;
a waveguide component at least partially disposed over the first surface of the substrate;
a first encapsulant encapsulating the first surface of the substrate and the waveguide component; and
a second encapsulant encapsulating the second surface of the substrate,
wherein the waveguide component comprises a waveguide channel accommodating a portion of the first encapsulant, and
wherein a lateral surface of the first encapsulant is substantially coplanar with a lateral surface of the second encapsulant.
13. The semiconductor device package of claim 12 , further comprising a connection element disposed over the second surface of the substrate and exposed from the second encapsulant, wherein the connection element is configured to connect to an external device.
14. The semiconductor device package of claim 13 , further comprising an antenna pattern disposed over the first surface of the substrate, wherein the substrate comprises a feeding element, and the waveguide channel is substantially aligned with the antenna pattern and the feeding element.
15. The semiconductor device package of claim 14 , further comprising a reflector disposed over the second surface of the substrate and encapsulated by the second encapsulant, wherein the reflector is substantially aligned with the feeding element.
16. The semiconductor device package of claim 14 , further comprising an electronic component encapsulated by the second encapsulant and configured to electrically connect with the feeding element and the connection element.