Patent Assignment
Reel/Frame 056581/0252
Assignment of Assignor's Interest
Recorded: 2021-06-18
Pages: 3
Assignors
CHEN, YANG-CHE
Executed: 2021-06-09
LIN, CHEN-HUA
Executed: 2021-06-09
LIANG, VICTOR CHIANG
Executed: 2021-06-10
TSENG, HUANG-WEN
Executed: 2021-06-09
LIU, CHWEN-MING
Executed: 2021-06-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Forming the Same