Patent Assignment
Reel/Frame 056594/0484
Assignment of Assignor's Interest
Recorded: 2021-06-20
Pages: 4
Assignors
LEE, SANGKYU
Executed: 2021-05-10
KIM, JINGU
Executed: 2021-05-10
LEE, YONGKOON
Executed: 2021-05-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package