Patent Assignment
Reel/Frame 056607/0662
Assignment of Assignor's Interest
Recorded: 2021-06-21
Pages: 5
Assignors
CHANG, CHIA-WEN
Executed: 2017-03-17
LIN, HONG-NIEN
Executed: 2017-03-17
LEE, CHIEN-HSING
Executed: 2017-03-17
CHANG, CHIH-SHENG
Executed: 2017-03-17
YEH, LING-YEN
Executed: 2017-03-20
TSAI, WILMAN
Executed: 2017-03-20
YEO, YEE-CHIA
Executed: 2017-03-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof