Patent Assignment
Reel/Frame 056620/0541
Assignment of Assignor's Interest
Recorded: 2021-06-22
Pages: 5
Assignors
KIM, JONGHAE
Executed: 2021-06-17
LAN, JE-HSIUNG
Executed: 2021-06-17
DUTTA, RANADEEP
Executed: 2021-06-17
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
3D Inductor Design Using Bundle Substrate Vias