Patent Assignment
Reel/Frame 056626/0018
Assignment of Assignor's Interest
Recorded: 2021-06-22
Pages: 5
Assignors
HUANG, HSIN-YEN
Executed: 2021-05-25
LO, TING-YA
Executed: 2021-05-28
LEE, SHAO-KUAN
Executed: 2021-05-25
TENG, CHI-LIN
Executed: 2021-05-28
LEE, CHENG-CHIN
Executed: 2021-05-25
CHANG, HSIAO-KANG
Executed: 2021-05-25
SHUE, SHAU-LIN
Executed: 2021-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Interconnection Structure and Methods of Forming the Same