Patent Assignment
Reel/Frame 056626/0208
Assignment of Assignor's Interest
Recorded: 2021-06-22
Pages: 4
Assignor
ZHANG, AMENG
Executed: 2021-03-26
Assignees
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
XINZHAN INDUSTRIAL PARK, HEFEI, ANHUI, 230012, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Method of Fabricating Array Substrate with Testing Pins
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 22, 2021
From: AI, YU
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056626/0156 →
Assignment of Assignor's Interest
Jun 22, 2021
From: XIE, XUEWU
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056626/0162 →
Assignment of Assignor's Interest
Jun 22, 2021
From: KONG, YUBAO
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056626/0181 →
Assignment of Assignor's Interest
Jun 22, 2021
From: SUN, SHI
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056626/0188 →
Assignment of Assignor's Interest
Jun 22, 2021
From: LIU, HAO
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056626/0204 →
Assignment of Assignor's Interest
Jun 22, 2021
From: LIU, BOWEN
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056648/0323 →
Assignment of Assignor's Interest
Sep 11, 2025
From: BOE TECHNOLOGY GROUP CO., LTD.
To: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 072866/0486 →