Method of fabricating array substrate with testing pins
A method of fabricating an array substrate is provided. The method includes providing a substrate including a gate pad configured to bond a gate driving integrated circuit, a data pad configured to bond a data driving integrated circuit, and a plurality of peripheral layout gate (PLG) proto-lines connecting the gate pad and the data pad; forming a PLG testing pad on the substrate; forming a shorting bar connecting the PLG testing pad to first terminals of the plurality of PLG proto-lines; forming a plurality of testing pins respectively connected to second terminals of the plurality of PLG proto-lines, wherein the plurality of testing pins are formed in a first dummy region of the substrate, the first dummy region is adjacent to an array substrate region of the substrate; and connecting the plurality of testing pins to a probe unit to test connectivity of the plurality of PLG proto-lines.
1 . A method of fabricating an array substrate, comprising:
providing a substrate comprising a gate pad configured to be bonded to a gate driving integrated circuit, a data pad configured to be bonded to a data driving integrated circuit, and a plurality of first connecting lines connecting the gate pad and the data pad;
forming a testing pad on the substrate;
forming a shorting bar connecting the testing pad to first terminals of the plurality of first connecting lines;
forming a plurality of testing pins respectively connected to second terminals of the plurality of first connecting lines, wherein the plurality of testing pins are formed in a first dummy region of the substrate, the first dummy region is adjacent to an array substrate region of the substrate; and
connecting the plurality of testing pins to a probe unit to test connectivity of the plurality of first connecting lines.
2 . The method of claim 1 , prior to providing the substrate, further comprising forming a plurality of additional pads between the data pad and the gate pad;
wherein a respective one of the plurality of first connecting lines is formed to extend from a respective first terminal to a respective second terminal connecting to a respective one of the plurality of testing pins; and
the respective one of the plurality of first connecting lines comprises a first portion and a second portion respectively in the array substrate region and respectively on two sides of a respective one of the plurality of additional pads, and a connecting portion connecting the first portion and the second portion, the connecting portion being in the first dummy region.
3 . The method of claim 1 , wherein connecting the plurality of testing pins to the probe unit comprises connecting the plurality of testing pins to a printing circuit board of the probe unit through a probe block of the probe unit thereby electrically connecting N number of the plurality of testing pins respectively to gate electrodes of N number of a plurality of transistors connected in series in the printing circuit board;
wherein a first test pin of the N number of the plurality of testing pins is also electrically connected to a source electrode of a first transistor of the N number of the plurality of transistors;
a drain electrode of a last transistor of the N number of the plurality of transistors is electrically connected to a light emitting element of the printing circuit board;
a source electrode of an n-th transistor between the first transistor and the last transistor is connected to a drain electrode of a (n−1)-th transistor, 1<n<N;
a drain electrode of the n-th transistor is connected to a source electrode of a (n+1)-th transistor.
4 . The method of claim 1 , further comprising providing a testing voltage signal to the testing pad;
wherein, upon providing the testing voltage signal to the testing pad, a light emitting element in a turning-off state indicates connectivity in at least one of the plurality of first connecting lines is compromised.
5 . The method of claim 1 , further comprising providing a testing voltage signal to the testing pad;
wherein, upon providing the testing voltage signal to the testing pad, a light emitting element in a turning-on state indicates connectivity in each of the plurality of first connecting lines is intact.
6 . The method of claim 5 , further comprising, based upon the light emitting element being in the turning-on state, cutting the substrate to form an array substrate;
wherein the plurality of first connecting lines are cut to form a plurality of second connecting lines, the plurality of second connecting lines are configured to transmit signals between the gate driving integrated circuit and the data driving integrated circuit in a display apparatus having the array substrate, the gate driving integrated circuit bonded to the gate pad, and the data driving integrated circuit bonded to the data pad.
7 . The method of claim 6 , prior to providing the substrate, further comprising forming a plurality of additional pads between the data pad and the gate pad;
wherein a respective one of the plurality of first connecting lines is formed to extend from a respective first terminal to a respective second terminal connecting to a respective one of the plurality of testing pins; and
the respective one of the plurality of first connecting lines comprises a first portion and a second portion respectively in the array substrate region and respectively on two sides of a respective one of the plurality of additional pads, and a connecting portion connecting the first portion and the second portion, the connecting portion being in the first dummy region; and
the respective one of the plurality of first connecting lines is cut along a first cutting line thereby removing the connecting portion.
8 . The method of claim 6 , wherein the plurality of first connecting lines are cut along a first cutting line between the first dummy region and the array substrate region, thereby removing the plurality of testing pins.
9 . The method of claim 6 , wherein the plurality of first connecting lines are cut along a second cutting line between a second dummy region and the array substrate region, thereby removing the shorting bar.
10 . The method of claim 2 , wherein the plurality of additional pads are a plurality of additional gate pads;
the gate pad and the plurality of additional gate pads are respectively directly adjacent to a first cutting line between the array substrate region and the first dummy region;
the data pad is directly adjacent to a second cutting line between the array substrate region and a second dummy region; and
the shorting bar and the first terminals are in the second dummy region.
11 . The method of claim 10 , wherein, prior to providing the substrate, further comprising forming a plurality of gate lines and a plurality of gate line lead wires respectively connected to the plurality of gate lines;
the plurality of gate line lead wires, the first portion, and the second portion respectively extend at least partially into the respective one of the plurality of additional pads;
the first portion is on a first side of the plurality of gate line lead wires; and
the second portion is on a second side of the plurality of gate line lead wires.
12 . The method of claim 1 , further comprising testing connectivity of a plurality of data lines in the substrate using a plurality of data line testing pads and a plurality of data lead wire shorting bars;
wherein the plurality of first connecting lines and a plurality of data lead wires respectively extend at least partially into the data pad;
the plurality of data lead wires are respectively connected to the plurality of data lines.
13 . An array substrate fabricated by the method of claim 1 .
14 . A display apparatus, comprising the array substrate of claim 13 , the gate driving integrated circuit bonded to the gate pad, and the data driving integrated circuit bonded to the data pad.
15 . An array substrate, comprising:
a gate pad configured to be bonded to a gate driving integrated circuit;
a data pad configured to be bonded to a data driving integrated circuit;
a plurality of connecting lines configured to transmit signals between a gate driving integrated circuit bonded to the gate pad and a data driving integrated circuit bonded to the data pad;
a testing pad; and
a plurality of first testing pads.
16 . The array substrate of claim 15 , further comprising:
a plurality of additional pads between the data pad and the gate pad; and
a plurality of additional lines configured to transmit signals between adjacent additional pads.