Patent Assignment
Reel/Frame 056626/0724
Assignment of Assignor's Interest
Recorded: 2021-06-23
Pages: 4
Assignors
HSU, CHIA-KUEI
Executed: 2021-05-26
YEW, MING-CHIH
Executed: 2021-05-26
YEH, SHU-SHEN
Executed: 2021-05-26
LIN, PO-YAO
Executed: 2021-05-26
JENG, SHIN-PUU
Executed: 2021-05-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metallization Structure and Package Structure