Patent Assignment
Reel/Frame 056639/0097
Assignment of Assignor's Interest
Recorded: 2021-06-23
Pages: 3
Assignor
LIAW, JHON-JHY
Executed: 2018-03-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure Including Multi-Length Source/Drain Contacts