Patent Assignment
Reel/Frame 056645/0121
Assignment of Assignor's Interest
Recorded: 2021-06-23
Pages: 4
Assignor
FANG, HSU-NAN
Executed: 2021-06-22
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same