IP Library › Assignment 056656/0418
Patent Assignment
Reel/Frame 056656/0418

Assignment of Assignor's Interest

Recorded: 2021-06-24 Pages: 7
Assignors
KIM, JIYE
Executed: 2021-06-09
SONG, IN CHEOL
Executed: 2021-06-09
JEON, WOONGPIL
Executed: 2021-06-09
KIM, DAIHONG
Executed: 2021-06-09
PARK, JAEBEOM
Executed: 2021-06-09
CHUN, BYUNGHO
Executed: 2021-06-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Apparatus for and Method of Manufacturing Semiconductor Device
Application: 17/356,998 →
Publication: US 2022/0157566