Patent Assignment
Reel/Frame 056657/0694
Assignment of Assignor's Interest
Recorded: 2021-06-24
Pages: 4
Assignor
PARK, DAHEE
Executed: 2021-06-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing Semiconductor Package