Patent Assignment
Reel/Frame 056666/0325
Assignment of Assignor's Interest
Recorded: 2021-06-25
Pages: 2
Assignor
JUNG, SEONG HWAN
Executed: 2021-06-22
Assignee
SOLUETA
498-42, HAEUN-RO, MADO-MYEON, HWASEONG-SI, GYEONGGI-DO, 18544, KOREA, REPUBLIC OF
Covered Property
(1)
Highly Heat-Dissipating Flexible Printed Circuit Board (Gfpcb), Manufacturing Method Therefor, and Led Lamp for Vehicle