Highly heat-dissipating flexible printed circuit board (GFPCB), manufacturing method therefor, and LED lamp for vehicle
View Patent ↗A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.
1. A highly heat-dissipating flexible printed circuit board (GFPCB) comprising:
a flexible board layer comprising a polyimide (Pl) film that is bonded to a lower side of a copper (Cu) film using an adhesive, the flexible board layer having a heat element installed on an upper side thereof
a heat dissipation layer comprising any one of graphitic carbon or graphite powder binder that is (a) coated on an upper side of an aluminum (Al) film and (b) bonded to a lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and;
a graphite powder layer that comprises a binder and that is positioned between the Pl film and the PSA.
2. The highly heat-dissipating flexible printed circuit board (GFPCB) of claim 1 , wherein the flexible board layer includes:
a cover layer covering an upper side of the copper film.
3. The highly heat-dissipating flexible printed circuit board (GFPCB) of claim 1 , wherein the heat dissipation layer includes:
graphitic carbon on the upper side of the aluminum film.
4. A vehicular LED lamp comprising:
the highly heat-dissipating flexible printed circuit board (GFPCB) according to claim 1 ;
a base housing forming a space for installing a lamp in a vehicle, and installed with the highly heat-dissipating flexible circuit board (GFPCB) in the space;
an LED module provided with a plurality of LEDs, and installed on a front surface of the highly heat-dissipating flexible circuit board (GFPCB);
a dispersion plate installed at a front end of the LED module to disperse light emitted from the LED module; and
a cover for covering the space formed by the base housing while transmitting the light dispersed by the dispersion plate.
5. A vehicular LED lamp comprising:
the highly heat-dissipating flexible printed circuit board (GFPCB) according to claim 2 ;
a base housing forming a space for installing a lamp in a vehicle, and installed with the highly heat-dissipating flexible circuit board (GFPCB) in the space;
an LED module provided with a plurality of LEDs, and installed on a front surface of the highly heat-dissipating flexible circuit board (GFPCB);
a dispersion plate installed at a front end of the LED module to disperse light emitted from the LED module; and
a cover for covering the space formed by the base housing while transmitting the light dispersed by the dispersion plate.
6. A vehicular LED lamp comprising:
the highly heat-dissipating flexible printed circuit board (GFPCB) according to claim 4 ;
a base housing forming a space for installing a lamp in a vehicle, and installed with the highly heat-dissipating flexible circuit board (GFPCB) in the space;
an LED module provided with a plurality of LEDs, and installed on a front surface of the highly heat-dissipating flexible circuit board (GFPCB);
a dispersion plate installed at a front end of the LED module to disperse light emitted from the LED module; and
a cover for covering the space formed by the base housing while transmitting the light dispersed by the dispersion plate.
7. A method for manufacturing a highly heat-dissipating flexible printed circuit board (GFPCB), the method comprising:
manufacturing a flexible board layer in a form of a flexibly bent thin film by bonding a polyimide (Pl) film to a lower side of a copper (Cu) film using an adhesive;
manufacturing a heat dissipation layer in a form of a thin film by coating any one of graphitic carbon or graphite powder binder on an upper side of an aluminum (Al) film;
using a binder to form a graphite powder layer between the polyimide film of the flexible board layer and a pressure sensitive adhesive; and
bonding the heat dissipation layer to a lower side of the flexible board layer by using the pressure sensitive adhesive (PSA).
8. The method of claim 7 , wherein manufacturing the highly heat-dissipating flexible printed circuit board includes:
forming a cover layer on an upper side of the copper film.
9. The method of claim 7 , wherein the heat dissipation layer includes:
graphitic carbon on the upper side of the aluminum film.