Patent Assignment
Reel/Frame 056708/0879
Assignment of Assignor's Interest
Recorded: 2021-06-29
Pages: 4
Assignors
ZHANG, SIQI
Executed: 2021-05-17
LIU, YANGMING
Executed: 2021-05-17
WANG, WEI
Executed: 2021-05-17
RAI, PRADEEP
Executed: 2021-05-17
WANG, XU
Executed: 2021-05-17
Assignee
WESTERN DIGITAL TECHNOLOGIES, INC.
5601 GREAT OAKS PARKWAY, SAN JOSE, CALIFORNIA, 95119
Covered Property
(1)
Semiconductor Device Package Having a Ball Grid Array with Multiple Solder Ball Materials
Application:
17/354,096 →
Publication:
US 2022/0406695
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Sep 17, 2021
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 057651/0296 →
Release of Security Interest at Reel 057651 Frame 0296
Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058981/0958 →
Patent Collateral Agreement - a&R Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
Patent Collateral Agreement - Ddtl Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
Assignment of Assignor's Interest
May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
Change of Name
Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
Patent Collateral Agreement
Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →