Patent Assignment
Reel/Frame 056719/0611
Assignment of Assignor's Interest
Recorded: 2021-06-30
Pages: 4
Assignors
LAI, LI-SHYUE
Executed: 2021-06-14
WU, GAO-MING
Executed: 2021-06-14
CHIANG, KATHERINE H.
Executed: 2021-06-14
LIN, CHUNG-TE
Executed: 2021-06-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Cavity in Metal Interconnect Structure