Patent Assignment
Reel/Frame 056734/0807
Assignment of Assignor's Interest
Recorded: 2021-07-01
Pages: 9
Assignors
LIU, NAI-WEI
Executed: 2021-03-31
CHI, YEN-YAO
Executed: 2021-03-31
KAO, YEH-CHUN
Executed: 2021-03-31
YEH, SHIH-HUANG
Executed: 2021-03-31
LIN, TZU-HUNG
Executed: 2021-03-31
HSU, WEN-SUNG
Executed: 2021-03-31
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU 300, ROC, TAIWAN
Covered Property
(1)
Semiconductor Package Structure with Antenna