Patent Assignment
Reel/Frame 056754/0406
Assignment of Assignor's Interest
Recorded: 2021-07-05
Pages: 3
Assignors
YANG, SHIN-YI
Executed: 2021-06-29
LEE, MING-HAN
Executed: 2021-06-28
SHUE, SHAU-LIN
Executed: 2021-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods for Forming the Same