IP Library Assignment 056756/0756
Patent Assignment
Reel/Frame 056756/0756

Corrective Assignment to Correct the First Inventor's Name and Date Previously Recorded on Reel 056540 Frame 0418. Assignor(S) Hereby Confirms the Assignment of Assignors' Interest.

Recorded: 2021-07-02 Pages: 12
Assignors
HONG, BYOUNGHAK
Executed: 2021-05-27
SONG, SEUNGHYUN
Executed: 2021-06-01
SEO, KANG-ILL
Executed: 2021-06-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Different Diffusion Break Structures for Three-Dimensional Stacked Semiconductor Device
Application: 17/335,834 →
Publication: US 2022/0302172
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 1, 2021
From: HONG, BYOUNGHAK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 056404/0899 →
Corrective Assignment to Correct the Add the Second Inventor Previously Recorded at Reel: 056404 Frame: 0899. Assignor(S) Hereby Confirms the Assignment. Jun 10, 2021
From: SONG, SEUNGHYUN; SEO, KANG-ILL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 056540/0418 →