IP Library › Assignment 056760/0094
Patent Assignment
Reel/Frame 056760/0094

Assignment of Assignor's Interest

Recorded: 2021-07-06 Pages: 3
Assignors
YAN, HUNG-JUNG
Executed: 2021-06-16
TSENG, LING-CHUN
Executed: 2021-06-16
WANG, CHUN-CHIEH
Executed: 2021-06-16
YANG, TZU-MING OU
Executed: 2021-06-16
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN
Covered Property (1)
Semiconductor Memory Structure and Method for Forming the Same
Application: 17/358,165 →
Publication: US 2022/0415781
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Fourth Inventor's Name Previously Recorded at Reel: 056760 Frame: 0094. Assignor(S) Hereby Confirms the Assignment. Jul 22, 2021
From: YAN, HUNG-JUNG; TSENG, LING-CHUN; WANG, CHUN-CHIEH; OU YANG, TZU-MING
To: WINBOND ELECTRONICS CORP.
Reel/Frame 056956/0743 →