Patent Assignment
Reel/Frame 056761/0419
Assignment of Assignor's Interest
Recorded: 2021-07-06
Pages: 9
Assignors
CHOI, JU-IL
Executed: 2021-05-18
PARK, JUMYONG
Executed: 2021-05-18
AN, JIN HO
Executed: 2021-06-24
OH, DONGJOON
Executed: 2021-05-18
LEE, CHUNGSUN
Executed: 2021-05-18
JIN, JEONGGI
Executed: 2021-05-18
CHUN, JINHO
Executed: 2021-05-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having First and Second Redistribution Patterns