Patent Assignment
Reel/Frame 056768/0217
Assignment of Assignor's Interest
Recorded: 2021-07-07
Pages: 4
Assignors
YEH, SHU-SHEN
Executed: 2021-06-20
LIN, PO-YAO
Executed: 2021-06-20
LIN, YU-SHENG
Executed: 2021-06-20
LAI, PO-CHEN
Executed: 2021-06-20
JENG, SHIN-PUU
Executed: 2021-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having First Heat Spreader and Second Heat Spreader and Manufacturing Method Thereof