Patent Assignment
Reel/Frame 056768/0225
Assignment of Assignor's Interest
Recorded: 2021-07-07
Pages: 3
Assignors
CHOU, CHIA-CHENG
Executed: 2021-05-17
KO, CHUNG-CHI
Executed: 2021-06-18
LEE, TZE-LIANG
Executed: 2021-06-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Interconnect Structures of Semiconductor Device