IP Library › Assignment 056807/0927
Patent Assignment
Reel/Frame 056807/0927

Assignment of Assignor's Interest

Recorded: 2021-07-09 Pages: 4
Assignors
SUGIMACHI, SEIYA
Executed: 2021-06-25
OKI, KAZUFUMI
Executed: 2021-06-28
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property (1)
Heat Conduction Pattern for Cooling a Power Module
Application: 17/372,127 →
Publication: US 2022/0208663