Heat conduction pattern for cooling a power module
A semiconductor module includes: a switching device including a gate pad; an output unit including an output pad connected with the gate pad of the switching device through a wire and outputting a drive signal from the output pad to the switching device; a temperature protection circuit detecting temperature and performing protection operation; and a heat conduction pattern connected with the output pad, extending from the output pad toward the temperature protection circuit, and conducting heat generated at the switching device to the temperature protection circuit.
1. A semiconductor module comprising:
a switching device including a gate pad;
an output unit including an output pad connected with the gate pad of the switching device through a wire and outputting a drive signal from the output pad to the switching device;
a temperature protection circuit detecting temperature and performing protection operation; and
a heat conduction pattern connected with the output pad, extending from the output pad toward the temperature protection circuit, and conducting heat generated at the switching device to the temperature protection circuit.
2. The semiconductor module according to claim 1 , wherein the heat conduction pattern overlaps the temperature protection circuit.
3. The semiconductor module according to claim 1 , wherein the heat conduction pattern surrounds the temperature protection circuit.
4. The semiconductor module according to claim 1 , wherein the heat conduction pattern includes a plurality of heat conduction patterns.
5. The semiconductor module according to claim 1 , wherein the temperature protection circuit is positioned closer to the output pad compared to other circuits.
6. The semiconductor module according to claim 1 , wherein the wire has a diameter of 200 to 500 μm.