Patent Assignment
Reel/Frame 056933/0625
Assignment of Assignor's Interest
Recorded: 2021-07-21
Pages: 4
Assignors
TSAI, CHEN-FONG
Executed: 2021-07-20
CHU, CHENG-I
Executed: 2021-07-20
SHEU, JYH-CHERNG
Executed: 2021-07-20
CHANG, HUICHENG
Executed: 2021-07-20
YEO, YEE-CHIA
Executed: 2021-07-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heat Dissipation for Semiconductor Devices and Methods of Manufacture