Heat dissipation for semiconductor devices and methods of manufacture
Semiconductor devices having improved heat dissipation and methods of forming the same are disclosed. In an embodiment, a device includes a first transistor structure; a front-side interconnect structure on a front-side of the first transistor structure, the front-side interconnect structure including front-side conductive lines; a backside interconnect structure on a backside of the first transistor structure, the backside interconnect structure including backside conductive lines, the backside conductive lines having line widths greater than line widths of the front-side conductive lines; and a first heat dissipation substrate coupled to the backside interconnect structure.
1. A device comprising:
a first transistor structure;
a front-side interconnect structure on a front-side of the first transistor structure, the front-side interconnect structure comprising front-side conductive lines;
a backside interconnect structure on a backside of the first transistor structure, the backside interconnect structure comprising backside conductive lines, the backside conductive lines having line widths greater than line widths of the front-side conductive lines; and
a first heat dissipation substrate coupled to the backside interconnect structure.
2. The device of claim 1 , wherein the first heat dissipation substrate comprises a heat sink, the heat sink comprising channels and fins in a surface opposite the backside interconnect structure.
3. The device of claim 1 , wherein the first heat dissipation substrate comprises embedded fluid channels.
4. The device of claim 1 , further comprising a second heat dissipation substrate coupled to the front-side interconnect structure.
5. The device of claim 1 , wherein the front-side interconnect structure has a thickness ranging from 0.5 μm to 2 μm and the backside interconnect structure has a thickness ranging from 0.5 μm to 1 μm.
6. The device of claim 1 , wherein a minimum line width of the front-side interconnect structure ranges from 15 nm to 45 nm, and wherein a minimum line width of the backside interconnect structure ranges from 30 nm to 60 nm.
7. The device of claim 1 , further comprising a second substrate coupled to the first heat dissipation substrate opposite the backside interconnect structure, wherein the second substrate is a printed circuit board.
8. A device comprising:
a first transistor structure;
a front-side interconnect structure on a front-side of the first transistor structure, the front-side interconnect structure comprising front-side conductive lines;
a backside interconnect structure on a backside of the first transistor structure, the backside interconnect structure comprising backside conductive lines, the backside conductive lines having line widths greater than line widths of the front-side conductive lines; and
a first heat dissipation substrate coupled to the backside interconnect structure, wherein the first heat dissipation substrate comprises a heat sink.
9. The device of claim 8 , wherein the heat sink comprises channels and fins.
10. The device of claim 9 , wherein the channels and fins of the heat sink are in a surface opposite the backside interconnect structure.
11. The device of claim 1 , further comprising a second heat dissipation substrate coupled to the front-side interconnect structure.
12. The device of claim 8 , wherein the front-side interconnect structure has a thickness ranging from 0.5 μm to 2 μm and the backside interconnect structure has a thickness ranging from 0.5 μm to 1 μm.
13. The device of claim 8 , wherein a minimum line width of the front-side interconnect structure ranges from 15 nm to 45 nm, and wherein a minimum line width of the backside interconnect structure ranges from 30 nm to 60 nm.
14. The device of claim 8 , further comprising a second substrate coupled to the first heat dissipation substrate opposite the backside interconnect structure, wherein the second substrate is a printed circuit board.
15. The device of claim 8 , wherein the first transistor structure comprises:
a gate structure over a semiconductor channel region;
a first source/drain region adjacent the gate structure and the semiconductor channel region;
a gate contact coupled to a surface of the gate structure facing a first direction; and
a first source/drain contact coupled to a surface of the first source/drain region facing a second direction opposite the first direction, the backside interconnect structure coupled to the first source/drain contact.
16. A device comprising:
a first transistor structure;
a front-side interconnect structure on a front-side of the first transistor structure, the front-side interconnect structure comprising front-side conductive lines;
a backside interconnect structure on a backside of the first transistor structure, the backside interconnect structure comprising backside conductive lines, the backside conductive lines having line widths greater than line widths of the front-side conductive lines; and
a first heat dissipation substrate coupled to the backside interconnect structure, wherein the first heat dissipation substrate comprises embedded fluid channels.
17. The device of claim 16 , further comprising a second heat dissipation substrate coupled to the front-side interconnect structure.
18. The device of claim 16 , wherein the front-side interconnect structure has a thickness ranging from 0.5 μm to 2 μm and the backside interconnect structure has a thickness ranging from 0.5 μm to 1 μm.
19. The device of claim 16 , further comprising a second substrate coupled to the first heat dissipation substrate opposite the backside interconnect structure, wherein the second substrate is a printed circuit board.
20. The device of claim 16 , wherein the first transistor structure comprises:
a gate structure over a semiconductor channel region;
a first source/drain region adjacent the gate structure and the semiconductor channel region;
a gate contact coupled to a surface of the gate structure facing a first direction; and
a first source/drain contact coupled to a surface of the first source/drain region facing a second direction opposite the first direction, the backside interconnect structure coupled to the first source/drain contact.