Patent Assignment
Reel/Frame 056950/0932
Assignment of Assignor's Interest
Recorded: 2021-07-22
Pages: 4
Assignor
SAWADA, TOYOJI
Executed: 2021-07-16
Assignee
SOCIONEXT INC.
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Method for Producing Semiconductor Device, Semiconductor Package, and Method for Producing Semiconductor Package