Patent Assignment
Reel/Frame 056972/0943
Assignment of Assignor's Interest
Recorded: 2021-07-26
Pages: 6
Assignors
PARK, JOOYONG
Executed: 2021-05-13
KIM, CHANHO
Executed: 2021-05-13
KWAK, PANSUK
Executed: 2021-05-13
BYEON, DAESEOK
Executed: 2021-05-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Device Including Memory Chip and Peripheral Memory Chip and Method of Manufacturing the Memory Device