Patent Assignment
Reel/Frame 056974/0066
Assignment of Assignor's Interest
Recorded: 2021-07-26
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming the Same