Patent Assignment
Reel/Frame 056978/0263
Merger
Recorded: 2021-07-26
Pages: 22
Assignor
SEGACIOUS INVESTMENT GROUP L.L.C.
Executed: 2015-08-28
Assignee
GULA CONSULTING LIMITED LIABILITY COMPANY
160 GREENTREE DRIVE, SUITE 101, DOVER, DELAWARE, 19904
Covered Properties
(2)
High Speed, High Density, Low Power Die Interconnect System
High Speed, High Density, Low Power Die Interconnect System
Application:
17/380,643 →
Publication:
US 2022/0115268