High speed, high density, low power die interconnect system
A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias.
1. A system comprising:
a first die including a plurality of conducting layers and a downwardly-facing surface;
a first inductive coupling portion arranged along the downwardly-facing surface of the first die;
a second die having one or more conducting layers and an upwardly-facing surface;
a second inductive coupling portion arranged along the upwardly-facing surface of the second die;
a third die including a plurality of conducting layers and a downwardly-facing surface, wherein the downwardly-facing surface of the third die is non-conductive;
wherein:
the first die and the third die are conductively coupled in a flip-chip orientation;
the first inductive coupling portion and the second inductive coupling portion are configured to inductively couple the first die with the second die; and
the downwardly-facing surface of the first die and the upwardly-facing surface of the second die are separated by an interface material comprising at least one of a heat conductor or an interposer.
2. The system of claim 1 , wherein the downwardly-facing surface of the first die and the downwardly-facing surface of the third die are not coplanar.
3. The system of claim 1 , wherein the first inductive coupling portion and the downwardly-facing surface of the third die are not coplanar.
4. The system of claim 1 , wherein the first die and the third die are conductively coupled with conductive balls.
5. The system of claim 1 , wherein the system is incorporated into a credit card.
6. The system of claim 1 , wherein the second inductive coupling portion comprises an antenna.
7. The system of claim 1 , wherein the first die comprises a plurality of transistors.
8. The system of claim 1 , wherein the third die comprises a plurality of transistors.
9. The system of claim 1 , wherein the first die comprises a plurality of transistors, and the second die comprises a plurality of transistors.
10. The system of claim 1 , wherein the first die comprises a plurality of conductive contact pads configured to conductively couple with a fourth die.
11. The system of claim 10 , wherein the plurality of conductive contact pads face upwardly.
12. The system of claim 1 , wherein the interface material comprises the heat conductor.
13. The system of claim 1 , wherein the interface material comprises the interposer.
14. The system of claim 1 , wherein the first inductive coupling portion comprises a spiral inductor.
15. The system of claim 1 , wherein the second inductive coupling portion comprises a spiral inductor.
16. The system of claim 1 , wherein the first inductive coupling portion comprises a spiral inductor, and the second inductive coupling portion comprises a spiral inductor.
17. The system of claim 1 , wherein the first inductive coupling portion comprises a horizontal inductive coupling portion, and the second inductive coupling portion comprises a horizontal inductive coupling portion.
18. The system of claim 17 , wherein the first inductive coupling portion spans only one conducting layer in the first die.
19. The system of claim 17 , wherein the second inductive coupling portion spans only one conducting layer in the first die.
20. The system of claim 17 , wherein the first inductive coupling portion spans only one conducting layer in the first die, and the second inductive coupling portion spans only one conducting layer in the second die.