Patent Assignment
Reel/Frame 056979/0165
Assignment of Assignor's Interest
Recorded: 2021-07-26
Pages: 4
Assignors
LIU, JEN-FU
Executed: 2021-07-14
TSENG, MING HUNG
Executed: 2021-07-14
LIN, YEN-LIANG
Executed: 2021-07-15
YEH, LI-KO
Executed: 2021-07-21
CHIANG, HUI-CHUN
Executed: 2021-07-20
WU, CHENG-CHIEH
Executed: 2021-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method for Forming a Semiconductor Structure Comprising Various via Structures