Patent Assignment
Reel/Frame 056995/0873
Assignment of Assignor's Interest
Recorded: 2021-07-27
Pages: 4
Assignors
CHENG, WEN-HAO
Executed: 2019-05-17
CHEN, YEN-YU
Executed: 2019-05-17
LIN, CHIH-WEI
Executed: 2019-05-17
DAI, YI-MING
Executed: 2019-05-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same