Patent Assignment
Reel/Frame 057004/0047
Assignment of Assignor's Interest
Recorded: 2021-07-28
Pages: 2
Assignor
ANDO, YUKIHIRO
Executed: 2020-11-10
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Solid-State Imaging Device with Increased Bonding Strength, and Method of Manufacturing the Solid-State Imaging Device