Patent Assignment
Reel/Frame 057010/0152
Assignment of Assignor's Interest
Recorded: 2021-07-28
Pages: 7
Assignors
KUO, CHUNG-HSING
Executed: 2021-07-23
YEH, CHUN-TING
Executed: 2021-07-23
LIN, MING-TSE
Executed: 2021-07-23
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device Including Elongated Bonding Structure Between the Substrate