Patent Assignment
Reel/Frame 057031/0055
Assignment of Assignor's Interest
Recorded: 2021-07-30
Pages: 4
Assignors
WU, I-WEN
Executed: 2021-01-06
LEE, CHEN-MING
Executed: 2021-01-06
YANG, FU-KAI
Executed: 2021-01-06
WANG, MEI-YUN
Executed: 2021-01-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Contact Structures and Methods of Fabricating Thereof