IP Library › Assignment 057059/0025
Patent Assignment
Reel/Frame 057059/0025

Assignment of Assignor's Interest

Recorded: 2021-08-02 Pages: 4
Assignors
LUM, FONG MEI
Executed: 2021-07-01
MAHLER, JOACHIM
Executed: 2021-07-01
SANUSI, MUHAMMAD MUHAMMAT
Executed: 2021-07-01
CHAN, SOOK WOON
Executed: 2021-07-12
LEE, SWEE KAH
Executed: 2021-06-30
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Semiconductor Device with a Heterogeneous Solder Joint and Method for Fabricating the Same
Application: 17/361,950 →
Publication: US 2022/0005778
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Last Name of the 3RD Inventor Previously Recorded at Reel: 057059 Frame: 0025. Assignor(S) Hereby Confirms the Assignment. Sep 15, 2021
From: LUM, FONG MEI; MAHLER, JOACHIM; MUHAMMAT SANUSI, MUHAMMAD; CHAN, SOOK WOON
To: INFINEON TECHNOLOGIES AG
Reel/Frame 057538/0205 →