Patent Assignment
Reel/Frame 057079/0086
Assignment of Assignor's Interest
Recorded: 2021-08-04
Pages: 2
Assignor
MIURA, KIWAMU
Executed: 2021-07-27
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Display Device and Electronic Device with Heat Absorption Layer Coupled to Pad Electrode Layer