Patent Assignment
Reel/Frame 057083/0779
Assignment of Assignor's Interest
Recorded: 2021-08-04
Pages: 3
Assignors
YEH, TING-YU
Executed: 2021-07-26
CHANG, CHUN-HUA
Executed: 2021-07-26
CHANG, FONG-YUAN
Executed: 2021-07-30
LEE, JYH CHWEN FRANK
Executed: 2021-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Arrangement of Power-Grounds in Package Structures