Arrangement of power-grounds in package structures
A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.
1. A structure comprising:
a device die;
an encapsulant encapsulating the device die therein;
a redistribution structure over and electrically connected to the device die, wherein the redistribution structure comprises a bottom layer and a plurality of upper layers over the bottom layer, and wherein the redistribution structure comprises:
a first power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers;
a second power-ground macro extending from the topmost layer in the plurality of upper layers to the bottommost layer in the plurality of upper layers;
at least one first conductive feature in the bottom layer and overlapped by the first power-ground macro; and
at least one second conductive feature in the bottom layer and overlapped by the second power-ground macro, wherein patterns of the at least one first conductive feature are different from the at least one second conductive feature.
2. The structure of claim 1 , wherein the at least one first conductive feature comprises a first plurality of conductive features, the at least one second conductive feature comprises a second plurality of conductive features, and a first total count of the first plurality of conductive features is different from a second total count of the second plurality of conductive features.
3. The structure of claim 1 , wherein the at least one first conductive feature comprises a first metal pad electrically disconnected from the first power-ground macro.
4. The structure of claim 1 , wherein the topmost layer comprises a solder region.
5. The structure of claim 1 , wherein the bottom layer is in contact with a metal pad in the device die.
6. The structure of claim 1 , wherein both of the first power-ground macro and the second power-ground macro are VDD macros.
7. The structure of claim 1 , wherein both of the first power-ground macro and the second power-ground macro are VSS macros.
8. The structure of claim 1 , wherein the first power-ground macro comprises a plurality of metal plates, each in one of the plurality of upper layers, and a plurality of vias in each of the plurality of upper layers, and wherein the plurality of metal plates in the first power-ground macro have identical patterns, locations, and sizes as corresponding ones of the plurality of metal plates in the second power-ground macro.
9. The structure of claim 1 , wherein the first power-ground macro comprises a plurality of metal plates, and edges of the plurality of metal plates are vertically aligned.
10. The structure of claim 1 , wherein the redistribution structure further comprises an additional layer over the bottom layer and under the plurality of upper layers, and wherein the redistribution structure further comprises a metal pad in the additional layer, and the metal pad is overlapped by, and is electrically disconnected from, the first power-ground macro.
11. A structure comprising:
a redistribution structure comprising a bottom layer and a plurality of upper layers over the bottom layer, wherein the redistribution structure comprises:
a first power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers; and
a first metal pad in the bottom layer and overlapped by the first power-ground macro, wherein the first metal pad is electrically disconnected from the first power-ground macro.
12. The structure of claim 11 further comprising a second metal pad in the bottom layer and overlapped by the first power-ground macro, wherein the second metal pad is electrically connected to the first power-ground macro.
13. The structure of claim 11 further comprising a device die overlapped by the first power-ground macro, wherein the device die further comprises a second metal pad physically bonding to the first metal pad.
14. The structure of claim 11 further comprising:
a second power-ground macro extending from the topmost layer in the plurality of upper layers to the bottommost layer in the plurality of upper layers, wherein the second power-ground macro is identical to the first power-ground macro; and
a second metal pad in the bottom layer and overlapped by the second power-ground macro, wherein the second metal pad is electrically connected to the second power-ground macro.
15. The structure of claim 14 , wherein a first total number of metal pads in the bottom layer and overlapped by the first power-ground macro is different from a second total number of metal pads in the bottom layer and overlapped by the second power-ground macro.
16. A structure comprising:
a device die comprising metal pads therein;
an encapsulant encapsulating the device die therein, wherein top surfaces of the encapsulant and the metal pads are coplanar; and
a redistribution structure over the device die and the encapsulant, wherein the redistribution structure comprises a bottom layer in contact with the metal pads, and a plurality of upper layers over the bottom layer, and wherein the redistribution structure comprises:
a first power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers; and
a first metal pad in the bottom layer and overlapped by the first power-ground macro, wherein the first metal pad is electrically disconnected from the first power-ground macro.
17. The structure of claim 16 , wherein the redistribution structure further comprises:
a second power-ground macro extending from the topmost layer in the plurality of upper layers to the bottommost layer in the plurality of upper layers; and
a second metal pad in the bottom layer and overlapped by the second power-ground macro, wherein the second metal pad is electrically connected to the second power-ground macro.
18. The structure of claim 16 , wherein the first power-ground macro comprises a solder region in the topmost layer in the plurality of upper layers.
19. The structure of claim 16 , wherein the plurality of upper layers comprise four layers.
20. The structure of claim 16 , wherein the first power-ground macro comprises a VDD macro.