IP Library › Assignment 057088/0450
Patent Assignment
Reel/Frame 057088/0450

Change of Name

Recorded: 2021-03-08 Pages: 10
Assignor
Assignee
HD MICROSYSTEMS, LTD.
4-25, KORAKU 1-CHOME, BUNKYO-KU, TOKYO, 112-0004, JAPAN
Covered Property (1)
Photosensitive Resin Composition, Cured Product of Same, Interlayer Insulating Film, Surface Protective Film and Electronic Component
Application: 16/320,889 →
Publication: US 2019/0161580
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 1, 2019
From: AZUMA, AYAKA; ABE, SATOSHI; SOEJIMA, KAZUYA; NISHIMURA, MASATO
To: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Reel/Frame 049643/0332 →