Change of Name

Recorded: 2021-08-02 Pages: 10

Assignor

Executed: 2020-08-01

Assignee

HD MICROSYSTEMS, LTD.

4-25, KORAKU 1-CHOME, BUNKYO-KU, BUNKYO-KU, TOKYO, 112-0004, JAPAN

Covered Properties (2)

Positive-Type Photosensitive Resin Composition

Patent: 11,592,743 →

Application: 16/075,416 →

Publication: US 2019/0041748

Positive-Type Photosensitive Resin Composition

Patent: 11,592,744 →

Application: 16/075,441 →

Publication: US 2019/0049842

Related Assignments (2)

Other recorded transfers of the patents in this record — the chain of ownership.