Positive-type photosensitive resin composition
A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO 2 —, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30.
1. A positive-type photosensitive resin composition comprising a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein
the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below,
the (b) crosslinking agent is represented by Formula (3) below, and
the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below,
wherein, in Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO 2 —, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30,
wherein, in Formula (3), R 3 is independently a hydrogen atom or —CH 2 —O—R 4 , and at least one of the plurality of R 3 s is —CH 2 —O—R 4 , R 4 is independently a hydrogen atom, a methyl group, an ethyl group, or a butyl group, and
wherein the (c) photosensitive agent is 1 to 20 parts by mass with respect to 100 parts by mass of the (a) polybenzoxazole precursor.
2. The positive-type photosensitive resin composition according to claim 1 , wherein the (b) crosslinking agent is represented by Formula (4) below
3. The positive-type photosensitive resin composition according to claim 1 , wherein the (c) photosensitive agent is represented by Formula (5) below,
(in Formula (5), Q is independently a hydrogen atom or a group represented by Formula (6) below, and at least one Q is a group represented by Formula (6) below)
4. The positive-type photosensitive resin composition according to claim 1 , wherein the aliphatic structure of V in Formula (1) is an aliphatic straight-chain structure having 5 to 10 carbon atoms.
5. A method of manufacturing a pattern cured film, comprising:
coating the positive-type photosensitive resin composition according to claim 1 on a substrate, drying the positive-type photosensitive resin composition, and thereby forming a photosensitive resin film;
exposing the photosensitive resin film to a predetermined pattern;
developing the exposed photosensitive resin film by use of an alkaline aqueous solution, and thereby forming a pattern resin film; and
heat-treating the pattern resin film.
6. The method of manufacturing the pattern cured film according to claim 5 , wherein in heat-treating the pattern resin film, a heat treatment temperature is 200° C. or less.
7. A cured product of the positive-type photosensitive resin composition according to claim 1 .
8. An interlayer insulating film, a cover coat layer, or a surface protection film using the cured product according to claim 7 .
9. An electronic component comprising the interlayer insulating film, the cover coat layer, or the surface protection film according to claim 8 .
10. The positive-type photosensitive resin composition according to claim 1 , wherein the (c) photosensitive agent is 5 to 15 parts by mass with respect to 100 parts by mass of the (a) polybenzoxazole precursor.