Patent Assignment
Reel/Frame 057131/0287
Assignment of Assignor's Interest
Recorded: 2021-08-10
Pages: 9
Assignors
JANG, SUKHWA
Executed: 2021-07-19
KIM, KANGUK
Executed: 2021-07-19
NOH, HYUNSUK
Executed: 2021-07-19
PARK, YEONGSHIN
Executed: 2021-07-19
SUN, SANGKYU
Executed: 2021-08-02
LEE, SUNYOUNG
Executed: 2021-07-19
LEE, SOHYANG
Executed: 2021-07-19
LEE, HONGJUN
Executed: 2021-07-19
JUNG, HOSUN
Executed: 2021-07-19
JIN, JEONGMIN
Executed: 2021-07-19
CHOI, JEONGHEE
Executed: 2021-07-19
CHOI, JINSEO
Executed: 2021-07-19
HONG, CERA
Executed: 2021-08-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Semiconductor Device