Methods of manufacturing semiconductor device

1. A method of manufacturing a semiconductor device, the method comprising:

forming a lower structure including a plurality of transistors;

forming a conductive layer on the lower structure;

forming first preliminary pad mask patterns and wiring mask patterns on the conductive layer;

forming pad mask patterns by patterning the first preliminary pad mask patterns while protecting the wiring mask patterns;

etching the conductive layer using the pad mask patterns and the wiring mask patterns as an etching mask to form pad patterns and wiring patterns; and

removing the pad mask patterns and the wiring mask patterns, after using the pad mask patterns and the wiring mask patterns as an etching mask or while using the pad mask patterns and the wiring mask patterns as an etching mask.

2. The method as claimed in claim 1 , wherein forming the first preliminary pad mask patterns and the wiring mask patterns includes:

forming a first mask layer on the conductive layer; and

patterning the first mask layer in a first patterning process using extreme ultraviolet (EUV) light as a light source.

3. The method as claimed in claim 2 , wherein forming the pad mask patterns by patterning the first preliminary pad mask patterns while protecting the wiring mask patterns includes:

forming a second mask layer covering the wiring mask patterns and the first preliminary pad mask patterns on the conductive layer;

patterning the second mask layer using a multi-patterning technique, the multi-patterning technique including performing a deposition process and an etching process once or more to form second preliminary pad mask patterns and a wiring mask protective layer; and

etching the first preliminary pad mask patterns, using the second preliminary pad mask patterns and the wiring mask protective layer as an etching mask, to form the pad mask patterns while protecting the wiring mask patterns,

wherein at least one of the wiring mask patterns has a first line shape extending in a first horizontal direction,

wherein each of the first preliminary pad mask patterns has a second line shape extending in a first diagonal direction forming an acute angle or an obtuse angle with respect to the first horizontal direction,

wherein each of the second preliminary pad mask patterns has a third line shape extending in a second diagonal direction intersecting the first diagonal direction, and

wherein the first horizontal direction, the first diagonal direction, and the second diagonal direction are parallel to a bottom of the lower structure.

4. The method as claimed in claim 3 , wherein patterning the second mask layer using the multi-patterning technique includes:

forming an upper layer on the second mask layer;

forming a capping mask layer on the upper layer; and

patterning the capping mask layer using a second photolithography process, the second photolithography process including using deep ultraviolet (DUV) light as a light source to form capping mask patterns and a protective mask pattern, the DUV light having a wavelength longer than a wavelength of the EUV light,

wherein the protective mask pattern overlaps the wiring mask patterns,

wherein each of the capping mask patterns has a fourth line shape extending in the second diagonal direction,

wherein a width of each of the capping mask patterns is greater than a width of each of the first preliminary pad mask patterns, and

wherein a distance between the capping mask patterns adjacent to each other is greater than a distance between the first preliminary pad mask patterns adjacent to each other.

5. The method as claimed in claim 4 , wherein patterning the second mask layer using the multi-patterning technique further includes:

forming a first liner layer covering the capping mask patterns and the protective mask pattern with a uniform thickness on the upper layer;

forming an upper capping layer overlapping the protective mask pattern while exposing a portion of the first liner layer overlapping the first preliminary pad mask patterns, on the first liner layer;

anisotropically etching the exposed first liner layer to form portions of the first liner layer which remain on side surfaces of the capping mask patterns;

removing the upper capping layer and the capping mask patterns;

etching the upper layer using the first liner layer as an etching mask and removing the first liner layer and the protective mask pattern, such that an upper protective layer is formed below the protective mask pattern, to form first upper patterns and the upper protective layer;

forming a second liner layer covering the first upper patterns and the upper protective layer with a uniform thickness, on the second mask layer;

forming gap-fill patterns on the second liner layer positioned between the first upper patterns;

performing a planarization process to remove a portion of the second liner layer disposed on upper surfaces of the first upper patterns and the upper protective layer;

anisotropically etching the second liner layer to form second liner patterns remaining below the gap-fill patterns, the second liner patterns and the gap-fill patterns sequentially stacked being defined as second upper patterns; and

etching the second mask layer by using the first upper patterns, the second upper patterns, and the upper protective layer as an etching mask to form the second preliminary pad mask patterns and the wiring mask protective layer.

6. The method as claimed in claim 5 , wherein a lower surface and a side surface of each of the gap-fill patterns contact the second liner layer.

7. The method as claimed in claim 5 , wherein:

the second upper patterns and the first upper patterns have line shapes parallel to each other, and

the first upper patterns are alternately and repeatedly arranged with the second upper patterns.

8. The method as claimed in claim 5 , wherein:

during the etching of the second mask layer by using the first upper patterns, the second upper patterns and the upper protective layer as an etching mask, to form the second preliminary pad mask patterns and the wiring mask protective layer, the first upper patterns, the second upper patterns, and the upper protective layer are removed by etching, and

the second preliminary pad mask patterns and the wiring mask protective layer have a thickness less than a thickness of the second mask layer.

9. The method as claimed in claim 1 , further comprising forming a lower layer on the conductive layer before forming the first preliminary pad mask patterns and the wiring mask patterns,

wherein etching the conductive layer using the pad mask patterns and the wiring mask patterns as an etching mask includes:

forming lower pad mask patterns below the pad mask patterns and lower wiring mask patterns below the wiring mask patterns,

exposing the conductive layer by etching the lower layer using the pad mask patterns and the wiring mask patterns as an etching mask, and

etching the exposed conductive layer to form the pad patterns remaining below the lower pad mask patterns and the wiring patterns remaining below the lower wiring mask patterns.

10. The method as claimed in claim 9 , wherein the pad mask patterns and the wiring mask patterns are removed while the lower layer is etched,

the method further comprising removing the lower pad mask patterns and the lower wiring mask patterns after forming the pad patterns and the wiring patterns.

11. The method as claimed in claim 1 , further comprising:

forming first insulating patterns filling between the pad patterns and second insulating patterns filling between the wiring patterns; and

forming a data storage structure on the pad patterns and the first insulating patterns.

12. The method as claimed in claim 11 , wherein the first insulating patterns and the second insulating patterns extend into the lower structure.

13. The method as claimed in claim 11 , wherein the data storage structure includes first electrodes electrically connected to the pad patterns, on the pad patterns, a second electrode covering the first electrodes, and a dielectric layer disposed between the first electrodes and the second electrode.

14. The method as claimed in claim 1 , wherein:

the lower structure further includes a semiconductor substrate having a memory cell area and a peripheral circuit area adjacent to the memory cell area,

the plurality of transistors includes cell transistors formed on the semiconductor substrate in the memory cell area, and a peripheral transistor formed on the semiconductor substrate in the peripheral circuit area,

the pad patterns are electrically connected to the cell transistors, and

at least some of the wiring patterns are electrically connected to the peripheral transistor.

15. The method as claimed in claim 14 , wherein:

the lower structure further includes bit lines and contact plugs,

each of the cell transistors includes:

a cell gate electrode formed in a cell gate trench crossing a cell active region,

a cell gate dielectric formed between the cell gate electrode and the cell active region, and

a first impurity region and a second impurity region formed in the cell active region on both sides of the cell gate electrode,

each of the bit lines is electrically connected to the first impurity region of each of the cell transistors, and

each of the contact plugs is electrically connected to the second impurity region of each of the cell transistors.

16. The method as claimed in claim 14 , wherein:

the lower structure further includes bit lines,

each of the cell transistors includes:

a lower source/drain region, a channel layer, and an upper source/drain region sequentially disposed in a vertical direction,

a cell gate electrode on a side surface of the channel layer, and

a cell gate dielectric between the cell gate electrode and the channel layer, and

the pad patterns are electrically connected to the upper source/drain regions of the cell transistors.

17. A method of manufacturing a semiconductor device, the method comprising:

forming a lower structure including first transistors and second transistors;

forming a conductive layer on the lower structure;

forming a first mask layer on the conductive layer;

patterning the first mask layer by using a first photolithography process to form first preliminary pad mask patterns and wiring mask patterns, the first photolithography process includes using extreme ultraviolet (EUV) light as a first light source;

forming second preliminary pad mask patterns and a wiring mask protective layer using a multi-patterning technique;

etching the first preliminary pad mask patterns, using the second preliminary pad mask patterns and the wiring mask protective layer as an etching mask, to form pad mask patterns while protecting the wiring mask patterns; and

etching the conductive layer using the pad mask patterns and the wiring mask patterns as an etching mask, to form pad patterns and wiring patterns,

wherein the pad patterns are electrically connected to the first transistors,

wherein at least some of the wiring patterns are electrically connected to the second transistors,

wherein the multi-patterning technique includes performing, at least once, a second photolithography process using deep ultraviolet (DUV) light, having a wavelength longer than a wavelength of the EUV light, as a second light source, and

wherein the multi-patterning technique further includes performing a patterning process once or a plurality of times, the patterning process including performing a deposition process and an etching process without a photolithography process.

18. A method of manufacturing a semiconductor device, the method comprising:

forming a conductive layer on a semiconductor substrate; and

patterning the conductive layer to form pad patterns and wiring patterns,

wherein patterning the conductive layer includes:

performing a first patterning process including a first photolithography process using extreme ultraviolet (EUV) light as a first light source, and

performing a second patterning process including a second photolithography process using deep ultraviolet (DUV) light, having a wavelength longer than a wavelength of the EUV light, as a second light source,

wherein the second patterning process is performed after the first patterning process is performed,

wherein the pad patterns are formed after performing both the first patterning process and the second patterning process, and

wherein the wiring patterns are formed by the first patterning process before performing the second patterning process.

19. The method as claimed in claim 18 , further comprising forming a data storage structure electrically connected to the pad patterns on the pad patterns, such that the data storage structure stores information on a volatile memory device or on a nonvolatile memory device.