IP Library › Assignment 057145/0265
Patent Assignment
Reel/Frame 057145/0265

Assignment of Assignor's Interest

Recorded: 2021-08-11 Pages: 3
Assignors
CHEN, CHUN-KAI
Executed: 2021-08-05
CHEN, JEI
Executed: 2021-08-08
LEE, TZE-LIANG
Executed: 2021-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Method for Forming Interconnect Structure
Application: 17/399,262 →
Publication: US 2023/0050514
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Corrected Assignment to Correct 2ND Inventor Name Previously Recorded Previously Recorded at Reel: 057145 Frame: 0265. Assignor(S) Hereby Confirms the Assignment. Nov 30, 2021
From: CHEN, CHUN-KAI; CHEN, JEI MING; LEE, TZE-LIANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 058282/0524 →