Corrective Assignment to Correct the Corrected Assignment to Correct 2ND Inventor Name Previously Recorded Previously Recorded at Reel: 057145 Frame: 0265. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2021-11-30 Pages: 8

Assignors

CHEN, CHUN-KAI

Executed: 2021-08-05

CHEN, JEI MING

Executed: 2021-08-15

LEE, TZE-LIANG

Executed: 2021-08-05

Assignee

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

Method for Forming Interconnect Structure

Patent: 11,842,922 →

Application: 17/399,262 →

Publication: US 2023/0050514

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.